Journal of Microelectronics and Electronic Packaging
SJR Rank #19,985H-index: 22SJR: 0.235Best quartile: Q3
Publisher
IMAPS-International Microelectronics and Packaging Society
Country
United States
Type
journal
SJR by Edition
Subject Categories
- Computer Networks and CommunicationsQ3
- Electrical and Electronic EngineeringQ3
- Electronic, Optical and Magnetic MaterialsQ4
Areas: Computer Science · Engineering · Materials Science
Most published research topics
Electronic Packaging and Soldering Technologies3D IC and TSV technologiesElectrical and Thermal Properties of MaterialsElectromagnetic Compatibility and Noise SuppressionSilicon Carbide Semiconductor TechnologiesFerroelectric and Piezoelectric MaterialsAdditive Manufacturing and 3D Printing TechnologiesHeat Transfer and OptimizationIntegrated Circuits and Semiconductor Failure AnalysisSemiconductor Lasers and Optical Devices
Source: OpenAlex
Publication Statistics
Documents per Year
Detailed Information
ISSN
1551-4897, 1555-8037
SJR Best Quartile
Q3
Region
Northern America
Citations per Document (2 years)
1.11
References per Document
22.09
Coverage
2005-2012, 2014-2025
Scope
No scope description available yet.
Metrics from SCImago Journal Rank 2025. View on SCImago