Soldering and Surface Mount Technology

SJR Rank #16,628H-index: 39SJR: 0.317Best quartile: Q3
Publisher

Emerald Publishing

Country

United Kingdom

Type

journal

SJR by Edition

2022202500.150.30.450.6

Subject Categories

  • Condensed Matter PhysicsQ3
  • Electrical and Electronic EngineeringQ3
  • Materials Science (miscellaneous)Q3

Areas: Engineering · Materials Science · Physics and Astronomy

Most published research topics

Electronic Packaging and Soldering Technologies3D IC and TSV technologiesManufacturing Process and OptimizationAdvanced Welding Techniques AnalysisDiverse Scientific and Economic StudiesAluminum Alloys Composites PropertiesIntermetallics and Advanced Alloy PropertiesBiotechnology and Related FieldsEducational Robotics and EngineeringRecycling and Waste Management Techniques

Source: OpenAlex

Publication Statistics

2025 Docs3-Year DocsCitable Docs0255075100

Documents per Year

20222025015304560

Detailed Information

ISSN

0954-0911, 1758-6836

SJR Best Quartile

Q3

Region

Western Europe

Citations per Document (2 years)

2.37

References per Document

33.06

Coverage

1989-2026

Scope

No scope description available yet.

Metrics from SCImago Journal Rank 2025. View on SCImago