Journal of Electronic Packaging

SJR Rank #11,961H-index: 68SJR: 0.497Best quartile: Q2
Journal website: aims, scope and author guidelines
Publisher

American Society of Mechanical Engineers (ASME)

Country

United States

Type

journal

SJR by Edition

2022202500.150.30.450.6

Subject Categories

  • Computer Science ApplicationsQ2
  • Electrical and Electronic EngineeringQ2
  • Electronic, Optical and Magnetic MaterialsQ2
  • Mechanics of MaterialsQ2

Areas: Computer Science · Engineering · Materials Science

Most published research topics

Electronic Packaging and Soldering TechnologiesHeat Transfer and Optimization3D IC and TSV technologiesHeat Transfer and Boiling StudiesHeat Transfer MechanismsAdhesion, Friction, and Surface InteractionsMechanical Behavior of CompositesThermal properties of materialsSilicon Carbide Semiconductor TechnologiesMetal Forming Simulation Techniques

Source: OpenAlex

Publication Statistics

2025 Docs3-Year DocsCitable Docs04590135180

Documents per Year

20222025020406080

Detailed Information

ISSN

1528-9044, 1043-7398

SJR Best Quartile

Q2

Region

Northern America

Citations per Document (2 years)

2.30

References per Document

30.85

Coverage

1989-2026

Scope

No scope description available yet.

Metrics from SCImago Journal Rank 2025. View on SCImago