Journal of Japan Institute of Electronics Packaging

SJR Rank #26,020H-index: 12SJR: 0.142Best quartile: Q4
Publisher

The Japan Institute of Electronics Packaging

Country

Japan

Type

journal

SJR by Edition

2022202500.040.080.120.16

Subject Categories

  • Electrical and Electronic EngineeringQ4

Areas: Engineering

Most published research topics

3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesDiverse Scientific and Economic StudiesHuman auditory perception and evaluationEducational Robotics and EngineeringCounseling, Therapy, and Family DynamicsSemiconductor Lasers and Optical DevicesLegal case studies and regulationsEarthquake and Disaster Impact StudiesManufacturing Process and Optimization

Source: OpenAlex

Publication Statistics

2025 Docs3-Year DocsCitable Docs090180270360

Documents per Year

202220250306090120

Detailed Information

ISSN

1343-9677, 1884-121X

SJR Best Quartile

Q4

Region

Asiatic Region

Citations per Document (2 years)

0.07

References per Document

9.39

Coverage

1998-2026

Scope

No scope description available yet.

Metrics from SCImago Journal Rank 2025. View on SCImago