IEEE Transactions on Components, Packaging and Manufacturing Technology

SJR Rank #7,381H-index: 122SJR: 0.763Best quartile: Q1APC: US$2,645
Publisher

Institute of Electrical and Electronics Engineers Inc.

Country

United States

Type

journal

SJR by Edition

2022202500.20.40.60.8

Subject Categories

  • Industrial and Manufacturing EngineeringQ1
  • Electrical and Electronic EngineeringQ2
  • Electronic, Optical and Magnetic MaterialsQ2

Areas: Engineering · Materials Science

Most published research topics

Electronic Packaging and Soldering Technologies3D IC and TSV technologiesMicrowave Engineering and WaveguidesElectromagnetic Compatibility and Noise SuppressionAdvanced Antenna and Metasurface TechnologiesSilicon Carbide Semiconductor TechnologiesHeat Transfer and OptimizationRadio Frequency Integrated Circuit DesignAntenna Design and AnalysisFerroelectric and Negative Capacitance Devices

Source: OpenAlex

Publication Statistics

2025 Docs3-Year DocsCitable Docs0200400600800

Documents per Year

20222025085170255340

Detailed Information

ISSN

2156-3950, 2156-3985

SJR Best Quartile

Q1

Region

Northern America

Citations per Document (2 years)

3.69

References per Document

33.18

Coverage

2011-2026

Scope

IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.

Metrics from SCImago Journal Rank 2025. View on SCImago